BD-8670

BD-8670

Product Details

BD-8670

Low Viscosity, High Strength, High Hardness Liquid Silicone Rubber

Chemical Composition: Two-component addition-cure liquid silicone resin

Product Introduction & Core Advantages

BD-8670 is a two-component addition-cure liquid silicone resin specifically designed for industrial potting applications requiring high strength and high hardness protection.

  • Superior Potting Processability: Features low viscosity (7000-15000 mPa·s) and excellent flowability after mixing. It de-airs easily and can penetrate tiny gaps in complex structures for thorough potting.
  • Powerful Mechanical Protection: After curing, it exhibits high hardness (Shore A 70) and high strength (Tensile ≥ 6MPa). The surface is dry with a good tactile feel, providing a robust physical barrier for internal components.
  • Efficient and Safe System: Utilizes platinum curing, making it environmentally friendly, safe, and non-toxic. Supports rapid thermal curing at 100°C for 10 minutes, significantly improving production efficiency.

Typical Physical and Chemical Data

Performance IndexTest Standard / ConditionBD-8670ABD-8670B
Appearance-Flowable translucent liquidFlowable translucent liquid
Specific Gravity (g/cc)ASTM D-14751.021.02
Mixing Ratio (By weight)-1 : 1-
Mixed ViscosityASTM D-23937000 - 15000 mPa·s-
HardnessASTM D-2240Shore A 70-
Elongation at BreakASTM D-412≥ 80%-
Tensile StrengthASTM D-412≥ 6 MPa-
Tear StrengthASTM D-624 die B≥ 12 KN/m-
Full Cure Time100±5℃10 Minutes-

Application Fields

  • General Potting Applications: Deep potting protection for internal structures of various conventional and specialized housings.
  • Core Electronic Control Equipment: Encapsulation of power supplies (power modules/power units), connectors, sensors, industrial control equipment, transformers, relays, etc.
  • Specialty Components & New Energy: Bonding/encapsulation materials for solar cells, high-voltage resistor components/packs, and protective coatings for fabric surfaces.

Instructions for Use

  1. Mixing: A/B components can be mixed using mechanical stirring or a static mixer.
  2. Curing Conditions: Can be cured within a temperature range of 40-150°C. Increasing the curing temperature can significantly shorten the curing time; however, for thicker products, caution should be exercised as excessively rapid curing may cause bubbles.
  3. Prevention of Inhibition: Clean all instruments and equipment before use. Substances containing tin salts, amines, or sulfur may inhibit the curing reaction (known as "silicone poisoning").
  4. Condition Testing: The performance of the product after curing depends on the curing conditions. It is recommended to perform tests prior to full-scale use to determine the optimal curing conditions.

Packaging & Storage

  • Packaging Specifications: 1kg and 25kg, customizable upon user request.
  • Storage Conditions: Store sealed in a cool, dry place.